Practical Guide for the Reliable Packaging of Electronics: Thermal and Mechanical Design Analysis

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Practical Guide for the Reliable Packaging of Electronics: Thermal and Mechanical Design and Analysis

Produktspecifikationer

Märke CRC Press
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  • 9781032881140

CRC Press

Design and Analysis of Thermal Systems

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ADVANCED PACKAGING TECHNOLOGY FOR ELECTRONICS: thermal dissipation strategies and microassembly integration

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